Foam Cream Foam Cream MYCO + REPAIR
Skin care for diabetes mellitus
Intensively supplies the skin with lipids and moisture. The patented technology strengthens the physiological skin barrier so that moisture cannot escape.
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The Allpresan diabetic foam cream MYCO + REPAIR is especially suitable for the care of plic-sensitive foot skin and for protection against athlete's foot in diabetes. The patented technology strengthens the physiological skin barrier so that moisture cannot escape. The foam cream based on BarrioExpert LIPO2 skin repair technology is specially adapted to the needs of diabetic skin.
- With Piroctom Plamine
- With biomimetic lipids
- Forms a breathable protective net without impairing the natural skin functions
- Without fragrance, colouring and preservatives
For the optimum care of diabetic feet, Allpresan diabetic Foam Cream MYCO + REPAIR should ideally be applied twice daily (morning and evening) to the very dry to scaly skin, or as required. A small amount is sufficient for large areas of skin. Allpresan diabetic Foam Cream MYCO + REPAIR is absorbed rapidly without greasiness, so clothing can be put on immediately after application. This product is suitable for external use only. Please shake well before use and hold upright while applying. Remove the tamper-proof seal at the back of the dispenser pump before first use.
Aqua, Decyl Oleate, Octyldodecanol, Butane, Glycerin, Propanediol, Panthenol, Cetyl Alcohol, Propane, Stearic Acid, Glyceryl Stearate, Hydrogenated Lecithin, Piroctone Olamine, Ceramide NP, Squalane, Butyrospermum Parkii Butter, Allantoin, Caprylyl Glycol, Palm Glycerides, Saccharide Isomerate, Sodium Lauroyl Sarcosinate, Potassium Lauroyl Wheat Amino Acids, Capryloyl Glycine, Caprylic/Capric Triglyceride, Pentylene Glycol, Hydrogenated Palm Glycerides Citrate, Rhamnose, Glucose, Glucuronic Acid, Citric Acid, Sodium Citrate, Tocopherol.
Note: We are constantly striving to improve our products. Therefore, our ingredients are subject to minor changes from time to time. You will find the latest information on the product packaging!